Investigations of plasma cleaning on the reliability of electrically conductive adhesives

For the replacement of solder as the usual connection between electrical components by Isotropic Electrically Conductive Adhesives (ICAs), it is important to maintain mechanical and electrical properties comparable to the solder's characteristics. One performance area capable of improvement is the mechanical adhesion between the ICA and the contact surface. Plasma cleaning of surfaces should provide better mechanical strength and contact resistance. This paper describes the effects of varying plasma process time and applied power on adhesion and electrical performance of ICA-connections.