Low-k dielectrics for ULSI multilevel interconnections: thickness-dependent electrical and dielectric properties

Electrical and dielectric properties of a promising low-dielectric constant (low-k) crystalline polymer thin film are investigated for deep-submicron multilevel interconnection applications. Filmetrics F20, I-V characteristic measurement, fourier transform infrared spectroscopy (FTIR), X-ray diffraction (XRD) are used to characterize the low-k film. The dc dielectric breakdown strength and the dielectric constant are obtained as a function of film thickness, and a model for the film thickness dependent breakdown strength is also discussed.