A Conversion Methodology for 200 mm Bulk Acoustic Wave Filter Production Line at Qorvo

There are many different methodologies for a line startup, process transfer, line conversion, and process upgrade in semiconductor IC manufacturing. In our startup of a 200 mm bulk acoustic wave filter line converted from an existing 150 mm production line, a methodology of copy, scale, develop, and match (CSDM) was introduced. This methodology includes four phases of matching (unit qualification, short flow verification, pathfinder validation, and qualification lot process) between 150 mm and 200 mm process, different failure mode effects analysis (DFMEA) for the risk assessment of the differences between two processes, process flow breakdown with process blocks and sub-blocks, a decide, define, determine, and design method of process evaluation with short loop flow process monitors based on DFMEA assessment. Following this CSDM methodology throughout the conversion process ensures that both electrical and reliability performances of 200 mm product wafers match to those of the 150 mm line. The first 200 mm full flow pathfinder lot with electrical yield on parity to 150 mm line yield. In this paper, the application of this CSDM methodology is discussed in detail.