System-In-Package (SIP): challenges and opportunities

In this paper, we propose the concept of System-In-Package (SIP) as a generalization of System-On-Chip (SOC). System-In-Package overcomes formidable integration barriers without compromising individual chip technologies. The goal of SIP is to match or exceed SOC performance with lower cost. SIP technology platform that provides the needed integration is described. Applications include integrating memory with logic and integrating radio frequency ICs with high-quality (high-Q) passive components. SIP technology will unleash the innovations of designers and unlock the full potential of IC technology.