Design and implementation of a MEMS-based RF oscillator on a unique silicon-ceramic composite substrate

In times, where the number of communication standards in mobile devices is growing, parameters like functional density, integrability, and power consumption become more and more important. Especially high frequencies and low channel bandwidths are the challenges that increase the need for new technology approaches and integration techniques. Micro-electromechanical systems (MEMS)-based designs can overcome traditional design trade-offs by high resonant frequencies and simultaneously high quality factors and small geometrical dimensions. This paper reports the design, implementation, and packaging of a compact MEMS-oscillator module on a silicon-ceramic composite substrate. First measurements show a good phase-noise performance, i.e. −80 dBc/Hz at an offset of 1 kHz. This underlines the capabilities of MEMS oscillators on this unique substrate: a small module size and low phase noise by reducing the substrate influence present in conventional oscillator designs.