Forced Convective Air-Cooling Effect on Electronic Components of Different Geometries and Orientations at Flow Shedding Region

The recent technological developments in electronics and product miniaturization demand high-performance thermal management to secure the reliability and the operating characteristics of the components. The present 2-D numerical study investigates heat transfer characteristics of different geometries of electronic components such as capacitors, resistors, condensers, and pin fin heat sinks and the additional effect of their optimized orientation in the confined forced convective air-cooling arrangement. The flow confinement effect is induced by preferring the blockage ratio (channel height/characteristic length of various geometries) to be 4. A finite volume-based flow solver is used to solve flow and energy equations. The resulting flow and heat transfer characteristics of various geometries studied from pressure contour, temperature contour, total drag coefficient, total pressure drop, Strouhal number, and volume goodness factor, and local and average Nusselt numbers for various Reynolds numbers such as 200, 400, 600, and 800. The average forced convection heat transfer enhancement depends on profoundly attached flow velocity, not on flow shedding. As per the thermal hydraulic performance, 45° tilted square front cum segment is the best among geometries considered for the analysis at this confinement.