Thermal fixing of volume holograms in Fe:LiNbO/sub 3/ crystals

We adapt a model proposed by Yariv to analyze the two recording procedures via the kinetics of the recording, fixing, and developing processes under either short circuit or preexposed open-circuit boundary condition. From the analysis, we deduce the optimal condition (in terms of the fixing temperature and the compensation time) for each procedure. The results provide useful guides to design thermal fixing procedures for reaching the maximum fixing efficiency.