Monolithic 3D-Enabled High Performance and Energy Efficient Network-on-Chip

Emergence of monolithic 3D (M3D) integration has opened up the possibility of designing the ultra-low-power and high-performance circuits and systems. The smaller dimensions of monolithic inter-tier vias (MIVs) offer high density integration, the flexibility of partitioning logic blocks across multiple tiers, and significantly reduced total wire-length. In this work, we explore the design space of M3D-enabled energy-efficient NoC architectures and present a comparative performance evaluation with TSV-based counterparts. We describe the optimization of the link and router placements of the M3D-enabled NoC to ensure maximum achievable performance. The placement of M3D-enabled routers and links are explored using a machine-learning-inspired optimization algorithm. The proposed M3D-enabled NoC architecture achieves 32% lower energy-delay-product (EDP) compared to the conventional mesh-based counterpart. We also demonstrate that for the diverse set of benchmarks considered in this work, the M3D-enabled NoC, on an average, achieves 28% lower EDP than the TSV-based counterpart.