High boron doped etch stop technique used in micromachining of silicon membranes and cantilevers [and optomechanical microsensor application]

This paper describes the manufacture of three dimensional microstructures, using p/sup +/ etch stop techniques. Our experiments focused on bulk and front side micromachining and the integration of these structures with optical waveguides for microsensors with optical read-out applications. By annealing treatment we reduce the tensile stress induced in the cantilever beams.