High power compact automotive IGBT module with planar technology

Power IGBT module is one of the crucial factors limiting overall performance, reliability and cost of Hybrid and Electric Vehicles (HEV/EV). A clear booming market of automotive power module has been seen with the accelerated development of HEV/EV. Although a series of standard and custom automotive modules meeting most of customer requirements had been proposed recently, the continuous development is essential to keep up with the innovation steps of HEV/EV. In this work, a high power, high performance, compact automotive IGBT module with planar packaging technology is developed. The optimized design and process, as well as the electrical test are reported. The planar packaging leads to the double side cooling (DSC) capability which improves significantly the thermal, electrical performance and reliability. We are at the stage of qualifying the module by automotive standard and the releasing the product in a short period of time.