Advanced UCT cleaning process based on specific gases dissolved ultrapure water

Advanced UCT cleaning process based on specific gases dissolved ultrapure water was developed. It is very simple process consisted of only 4 steps as follows: ozonated ultrapure water cleaning; small amount of ammonia added hydrogenated ultrapure water with megasonic irradiation cleaning; hydrofluoric acid and hydrogen peroxide mixture cleaning; and hydrogenated ultrapure water rinse. Compared with previous UCT, it is characterized by a removing process using an organic chemical such as a surfactant, so waste water from this process is easy to reclaim. This cleaning technology is also effective for promoting ESH (Environment, Safety and Health) in semiconductor manufacturing, the reason why the usage of chemicals and water for wafer cleaning can be drastically reduced. The advanced UCT cleaning process is very suitable for contamination-free surfaces as well as cost reduction for future device fabrication.