Evaluation of the yield impact of epitaxial defects on advanced semiconductor technologies

The SPI/sup TB1/ defect inspection system was used to inspect epitaxial wafers for an advanced semiconductor manufacturing process to distinguish particles from epitaxial defects (e.g., stacking faults, epi-spikes, mounds, hillocks, and pits) using real-time defect classification (RTDC). The project results indicate that the enhanced defect sensitivity, better capture rate, and the RTDC capabilities of the SPI inspection system can provide a significant improvement in the current defect inspection capabilities for epitaxial wafers. Historical results, from in-line defect inspections on product wafers, have shown that epitaxial defects can have a significant impact on the product yields of advanced semiconductor technologies.