Novel sample preparation and high-resolution X-ray tomography for package FA

In this study, we introduce high-resolution X-ray tomography into the daily failure analysis (FA) work flow for semiconductor packages. Two application cases, the investigation of Back-end of line (BEOL) and μ-bump features have been selected to demonstrate its advantage. The paper focuses on a feasibility study for different measurement parameters and proposes an advanced FA flow including newly-developed sample I preparation based on ps-laser excitation.