Contact and line resistivity in nanogranular compound materials fabricated with focused electron beam induced processing

Using organometallic compounds and an electron beam of high power density, novel nano-granular compound materials were fabricated with nm precision in a slow step deposition process. We investigate the electrical characteristics of the compound-material and found out that the measured resistivity can only be explained as a contact resistivity from the deposited material to the metal contact, which is used to connect the nano-wires to the standard measuring equipment. In our experiments, no line resistivity was observed, but only a contact resistivity, which was dependent on the overlap area of the contact wire and the deposited compound material. The deposition by Focused Electron Beam Induced Processing (FEBIP), with is a slow fabrication method, was performed at room temperature, as it were the measurements. 4-point measurements revealed no resistivity of the nano-wires, but only the contact resistance of the lines to the gold contacts.