Application of holography to evaluate the thermal deformation of printed circuit board connector due to thermal stress

The contact resistances of thermally stressed PCB connector contacts were measured. The holographic interferometry measuring system (HIMS) was applied to analyze the thermal deformation of the PCB connector due to current flow. As a result, we found some contact failure, and the HIMS was shown to be a very effective tool to measure the microscopic deformation pattern. In this paper, an experimental condition for application of thermal stress, the HIMS and the experimental results were introduced along with some suggestions for choosing high current contacts in a connector from the thermal deformation viewpoint.