Influence of packaging effects on the mobile noise of planar SQUID gradiometer for airborne magnetic measurements

The warpage, vibration mode, frequency response characteristics and their impact on mobile noise of planar SQUID (Superconducting quantum interference device) gradiometer were studied and evaluated by using mechanical simulation and experiment methods. Firstly, ANSYS static mechanical method was used to simulate the stress and deformation of SQUID with various adhesive bonding methods. The correlation between warpage and unbalance was also set up. On this basis, modal analysis method was used to study the vibration modes and frequency response characteristic as well as their dynamic effect on unbalance of gradiometer. Secondly, by means of magnetic measurement the static unbalance as well as response of the planar SQUID gradiometer with various packaging parameters were performed. Compared the simulation results with the experiment, warpage and its impact on unbalance of planar SQUID gradiometer were validated.