Low temperature sintering of nanosilver paste for super-large-area substrate bonding

Most existent studies of nanosilver paste, a promising package material, focused on a relatively small sintering area (<; 100 m²). In this study, we were trying to bond 40 mm × 40 mm copper baseplate with 25 mm × 25 mm DBC using nanosilver paste in low temperature and pressure. Shear strength distribution and morphology was reported in this work. Through this process, the average shear strength of the bonding sample reached up to 37.07 MPa. In the meanwhile the morphology was quite dense and uniform, and the porosity rate is 7.73%. Experiment proved that nanosilver paste can be used to bond super-large-area components together.