A Novel 3D IC Wafer-Level-Package for New Wave MEMS

Smaller footprint, thinner packages and simultaneously increased functionality are general requests for all electronic products and as well hold true for MEMS sensors. Current standard packaging technology for MEMS sensors is stacking the ASIC and MEMS silicon dies on a substrate. The sensitive dies are then either protected by over-molding or by attaching some sort of lid. Typical substrate materials are metal lead-frames or organic laminates. The function of the substrate is to route the external signals to the pads or balls on the bottom side of the 1st lvl package. The unparalleled flexibility and time to market of this packaging technology is bought by a significant contribution of the package to footprint and height. To enable further miniaturization while keeping high performance a Chip-to-Wafer (C2W) Wafer-Level Package (WLP) platform has been created by applying a series of innovative technologies, including Through-Silicon-Via (TSV) and Wafer-Level Assembly. Compare to regular logical product, MEMS/sensor product not only require electrical connection, but the stability & repeatability of performance are necessary. [1], [2], [3].