Modified Kron's TAN modeling of 3D multilayer PCB

An unconventional circuit modelling for 3D multilayer printed circuit board (PCB) is developed. The modelling methodology uses the tensorial analysis of network (TAN) approach. The multilayer PCB TAN model is based on the modified Kron's formalism. This unfamiliar circuit modelling is first time applied to the multilayer PCB interconnect modelling. After the diakoptics analysis of the proof of concept structure, the equivalent graph topology is established. By analogy, the posed problem to be solved can be formulated by the consideration of four-layer PCB structure. The solution is implemented in Python programming of the proposed model mathematical abstraction. The proposed unconventional TAN model is validated by comparison with a 3D EM commercial tool with very wideband S-parameter computation from DC-to-5GHz.