A MEMS device for fracture toughness measurement of 2D nano films under TEM imaging

This paper reports a transmission electron microscopy TEM-compatible MEMS device for the measurement of fracture toughness of 2D nano films. The MEMS device enables the creation of well-controlled electron-induced cracks in nano thin films, the measurement of film thickness, and tensile testing of films simultaneously all on chip. The device and techniques are applicable to the fracture toughness measurement of various types of nano films inside TEM.