Thermal characterization of diamond-pressure-bond heat sinking for optically pumped mid-infrared lasers

The heat-sinking properties of optically pumped semiconductor lasers mounted by the diamond-pressure-bonding (DPB) technique have been evaluated quantitatively. This method combines epi-side-down mounting with minimal processing and top optical access via pumping through the diamond. By correlating the pump-intensity variation of the emission wavelength with its temperature variation, specific thermal resistances have been determined for DPB-mounted type-II "W" lasers operating in the mid-infrared. Values <2.0 K/spl middot/cm/sup 2//kW were obtained for all temperatures in the range 140-220 K.