Comprehensive analysis on SCM specifications for high-performance SCM/NAND flash hybrid SSD with through-silicon via

By adding SCM to NAND flash-based SSD, SCM/NAND flash hybrid SSDs have been proposed for performance improvement. This paper analyzes effects of SCM specifications such as read/write latency, capacity and I/O frequency on performance of the hybrid SSD with through-silicon via (TSV). From the evaluation results, TSV reduces energy consumption by 38% when the SCM capacity is 1% of the NAND flash capacity. In addition, the hybrid SSD achieves 2.1-times Input/Output per Second (IOPS) performance improvement compared with NAND flash-only SSD. The power consumption dependency of the SCM read/write latency and I/O frequency is also analyzed. Only SCM capacity affects the power consumption reduction by TSV. When the SCM capacity is 1% in the hybrid SSD, TSV reduces power consumption by up to 38%. In contrast to the result of power consumption, SCM capacity, read/write latency, and I/O frequency have a large effect on the IOPS performance. Up to 81-times IOPS performance is achieved when SCM capacity, latency, and I/O frequency are 10%, 100 ns, 4266 MHz, respectively.