Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)

Direct bonding of polyoxymethylene (POM) at 100 °C was feasible using self-assembly monolayers (SAM). The POM substrates were first activated by vacuum ultraviolet irradiation in presence of oxygen gas (VUV/O
₃
) and then modified with SAM: (3-Aminopropyl)triethoxysilane (APTES) and (3-Glycidyloxypropyl)trimethoxysilane (GOPTS), respectively. Fourier transform infrared spectroscopy showed that both APTES and GOPTS modifications were successful. The bonding reached an average bonding strength of 0.37 MPa, and bulk fracture was observed after the debonding test. Surface observation results showed VUV activation process time played an important role in bonding. This technology is expected to be applied in future bio-inert electron devices.