A new approach to the investigation of interconnection delay for multichip models

To push high performance computer systems to higher speeds will require that they must be packaged more densely. Multichip packaging provides higher packaging density and ensures reduced interconnect delays in general. Based on the first three moments, we present a new delay model for MCM interconnection networks. From this paper it is concluded that Elmore delay and the model using the first two moments are two specially cases of our delay model. Our results reveal a critical link between net response and net electrical properties, and provide a much more accurate method for computing interconnection delay.