Improved design for microplasma generation using planar interdigitated terminal (IDT) structure for explosive fuse applications

This paper discusses about improved design for microplasma generation using a planar interdigitated terminal (IDT) structure. The IDT structure is fabricated by Au electroplating (5 μm) using a single mask process on quartz wafer. The gap between the subsequent IDT fingers is kept at 30 μm. The IDT structure showed microplasma generation at 570-580 V bias in atmospheric condition.