Thermal design of 28-Gb/s × 24-channel CDR-integrated VCSEL-based transceiver module

We report the thermal design of 28-Gb/s × 24-channel CDR-integrated VCSEL-based transceiver optical module for high density optical interconnects. The transceiver module realizes a very high data rate density of 1346 Gb/s/inch
²
at a total power consumption of 9.1 W. A unique design of this optical module realizes to use the whole top surface for thermal dissipation. We performed thermal simulations to reduce the temperature difference between case temperature and device temperatures. As investigated the thermal characteristics in both calculation and measurement, the maximum temperature difference can be suppressed to ~8 °C. All device temperatures are within their operating temperature at the maximum case temperature of 70 °C. Activating all 24 channels, we operated the optical module by a 28.05-Gb/s 2
³¹
-1 PRBS for each channel. All channels exhibited clearly opened eye diagrams and a total jitter margin of ~0.48 U.I. at a case temperature of 70 °C.