Shielding effectiveness modeling and measurement of multiple layers conformal shielding on system-in-package (SiP) module

To suppress the electromagnetic interference (EMI) of advanced system-in-package (SiP) module, conformal shielding technology is discussed in recent years. Shielding effectiveness (SE) is the index to identify the performance of the shielding solutions. In this paper, generic equivalent transmission line method is proposed to deal with both metal and dielectric materials for multiple layer shielding solutions. This method is easy to implement by using arbitrary cascade network analysis. In this paper, sputtered copper/nickel case is studied. Also, near field measurement is employed to measure the SE performance and compared with the modeling result. It is demonstrated that both measurement and modeling results are in good correlation within 1 GHz range.