Deformation prediction of 2.5D IC package

2.5D IC integrates heterogeneous chips by interposer with the technologies of through silicon via and re-distribution layer on it. It has the structure that chips are stacked on interposer then mounted on substrate with numerous micro-bumps and C4 bumps. For 2.5D IC package development, warpage control and interlayer dielectric interface stress minimization for potential delamination risk elimination are the crucial matter. A warpage contour and in-plane thermal strain well validated finite element model is crucial for design optimization and risk assessment. In this study, an equipment named advanced metrology analyzer based on three-dimensional digital image correlation technology, a non-contact optical deformation measurement scheme, was used to measure precise warpage and in-plane thermal strain for validation. Based on the well validated golden model, several parameters are studied to optimize package warpage and interposer interlayer dielectric stress.