A novel design concept for a super compact power amplifier module (SCPAM) using a multilayer substrate

This paper presents a novel circuit and layout design concept for a Super Compact Power Amplifier Module (SCPAM) using a multilayer substrate. This concept enables miniaturization of the module, while continuing to allow easy design and good performance. A 0.04 cc 1 W class module for mobile communication systems is demonstrated. A 0.02 cc module including this concept is also proposed.