Bonding process using microscale Ag particle paste for die attach

To avoid the use of high-lead-containing solders in electronics, new lead-free materials and bonding processes are desirable in the world and some solutions have explored for high-temperature applications. Recently, focusing on the use of nanoscale materials, the sintering behavior of nanoparticles has attracted interest as a high-temperature bonding processes. In this study, a feasibility study has been conducted to determine where chestnut-burr-like micro-sized Ag particles can be used as a bonding material. The shear strength of the joints using micro-sized Ag particle paste was investigated and the interfacial microstructure of the joints was observed by SEM and EPMA.