Non-destructive die attach test method for future robust packages - a proposal

In order to facilitate the evaluation the quality of layer compositions in terms of reliability, a new, non-destructive test method will be proposed in this paper. The new test method combines finite element simulations with creep testing. The advantage of this new method is that it gives a closer representation of the actual use conditions of the later device. This makes it easier to link results from experiments in a laboratory on a simple test vehicle to the later use conditions and to the desired lifetime of the product.