Modelling the 3D-printing process for electronics packaging

3D printing offers the possibility to fabricate parts and products in a cost-effective, high-throughput, mass-customisation and energy efficient manner across a diverse range of applications. This paper details the key challenges in adopting 3D printing in electronics manufacturing and sets the design and modelling approaches best suited to carry out assessment and optimisation of performance, quality and reliability of printed electronics products. Applications of several different modelling methods and methodologies are discussed in this context and demonstrated using illustrative study cases. The originality of this work is in the adoption and application of best-in-class modelling techniques that can expand the toolsets currently used to support technology development and DfX activities for printed electronics.