Non-contact direct metallization of a crystalline silicon solar cell by electrostatic-force-assisted dispensing printing

As the industrial demand on new front grid metallization with high aspect ratio on a crystalline silicon solar cell wafer as thin as 100 μm increases, diverse non-contact printing techniques have been developed. Dispensing printing among the explored non-contact printing techniques has drawn wide attention due to its simplicity and capability to meet the industrial requirements. However, the employment of highly viscous silver paste with high yield stress hampers sound mechanical contact of silver paste on the textured surface of a crystalline silicon solar cell. In this work, a newly developed printing technique, i.e., `electrostatic-force-assisted dispensing printing,' is demonstrated and its impact on mechanical adhesion and electrical characteristics is discussed.