PA Thermal Management and Packaging: Wideband PA and Packaging, History, and Recent Advances: Part 2

Wide-band power amplifiers (PAs) are considered the most expensive and critical component for RF and microwave applications. New power systems, including those for radars, transmitters, electronic warfare (EW) jammers, and electromagnetic compatibility (EMC) testers, require the latest, state-of-the-art semiconductor technologies for power, linearity, and bandwidth [1], [2]. In addition, wide bandwidth is essential for high-speed communication and high resolution in radar, imagers, and sensors [2], [3]. In modern electronic vehicles, complexity is rapidly increasing and imposing strict EMC regulations, which often require very high 1-dB compression point (P1dB) power [to kilowatt, continuous wave (CW)] across an ultrawide bandwidth (decade) with high linearity, good reliability, and long life [4], [5].