Design and characterization of petaloid hollow Cu interconnection for interposer

In this paper, a novel petaloid hollow Cu interconnection for interposer is presented, its stress can be released by free ends face to hollow Cu interconnection center, and its fabrication process for Si substrate and glass substrate are also presented. Stress distribution and Max. stress of interposer with petaloid hollow Cu interconnection comparison with normal TSV is simulated and analyzed by thermal-mechanical model. Typical electrical path composed of petaloid hollow Cu interconnection is modeled, coupling influences of structure changing and thermal vibration on its electrical property is analyzed.