Analysis of solder joint shape parameters on the stress and strain of the solder joint in the random vibration condition

In this paper, the finite element model of optical interconnection module is established, and the finite element analysis of the model is carried out under the condition of random vibration loading based on ANSYS software. The distribution law of the stress and strain of the solder joint array is obtained. As an example, the stress and strain of the solder joint array with single factor variation of the shape parameters of the model were analyzed under the random vibration condition. The results show that the distribution of the stress and strain of the solder joint array is not uniform, and the change tendency of the stress and strain is presented by the inner layer of the solder joint to the outer solder joint. Among them, the maximum stress strain value of solder joints in the corner of the outer layer of the solder joints array region. With the increase of height of solder joint, solder joint array should strain showed a tendency to increase, along with increase of the volume of solder joint, solder joint array should stress and strain values decrease gradually, with pad diameter increases, the solder joint array should stress and strain value increases.