Innovative Temperature and Heat Distribution Measurement Protocol Applied to 3D TSV Technology

This paper presents a new test protocol aimed at accurately determining the temperature of 3D electronic circuits as well as their heat distribution. It is based on AC electrical measurements coupled with InfraRed Lock-In Thermography (IR LIT) measurements. The circuit temperature is assessed thanks to AC resistance measurements and the Temperature Coefficient of Resistance (TCR) of metallic layers. The heat distribution is measured with an IR LIT system synchronized with the AC resistance measurement signal. The protocol has been applied on a Through Silicon Via (TSV) daisy chain of a silicon interposer on which temperature and heat distribution have been measured.