Determination of Adhesion Strength of EMC/PSR Interface in Thin Packages Using Modified Offset Single Cantilever Adhesion Test

We propose and implement a novel test method to determine the adhesion strength at the EMC/PSR interface in thin multilayer stacks. The proposed modified offset single cantilever adhesion test (MOSCAT) method is optimal for quick and quantitative testing of strong interfaces inside thin multilayer structures as sample preparation and testing is considerably simpler than traditional DCB tests while still maintaining a loading configuration that provides a lower mode mixity at the crack tip than 4PB tests. Following detailed sample preparation and experimental testing to determine the critical load required for delamination, a numerical model of the sample is created and run at the critical condition to assess the stress and strain fields around the crack tip at the point of delamination, thus allowing for the J-integral method to be employed to determine the critical energy release rate. The results obtained from the EMC/PSR interface tests confirm the accuracy and repeatability of the proposed method.