Design of a Pancake-Type Superconducting Tape Winding According to Heat Diffusion Ability

The objective of this paper is to design a pancake-type superconducting tape winding with a good heat diffusion ability. In this paper, a recovery time test was used to verify the heat diffusion ability of windings. Three methods were proposed to improve the heat diffusion ability of the pancake-type superconducting tape winding. The three methods were using a slot-type pancake winding, opening the windows in slots, and increasing the distance between winding plates. The recovery time of superconducting tapes in the slot-type pancake winding is equal to that of the bare tapes. Opening the windows in slots and increasing the distance between winding plates are useful to decrease the recovery time. If three methods are used altogether, a good heat diffusion ability can be achieved. Based on the three strategies, a winding plate with a diameter of 366 mm was designed. For a single winding plate, a 9-m superconducting tape was wound. It is able to work under 500 V at a 50-ms current flowing time. It saves 58% of the size compared with the solenoid-type winding with the same heat diffusion ability.