Cure kinetics study of a novel die attach adhesive for high power light-emitting diode

The curing behavior and kinetics of alicyclic epoxy resin (ERL-4221) and bisphenol F epoxy resin (DER-354) using triarylsulfonium hexafluoroantimonates(TASH) as the cationic initiators were studied by differential scanning calorimetry (DSC) at different heating rates. Kinetic parameters of the curing process were calculated and established by the Kissinger, Ozawa and Crane methods. The results showed that the activity of ERL-4221 system was obviously higher than that of DER-354 system in the cationic polymerization system initiated by TASH. Non-Isothermal DSC experiments have confirmed these findings. At the same time, the the kinetic parameters of ERL-4221 and DER-354 systems were corresponding to 87.04 kJ/mol, 2.15×10
⁸
s
^-1
, 0.9763 and 75.56 kJ/mol, 4.81 × 10
⁶
s
^-1
, 0.9610, by the Kissinger and Crane method, and the curing reactions both followed the first order reaction kinetics mechanism. The Ozawa method also obtained similar results.