Development of a 3D Stacked Package Solution for NAND 64DP Package

The need for high stacked NAND package is driven by solid state drives. Customers generally want more NAND density per package placement. Stacking chips into the vertical or third dimension (3-D) has evolved into the stacking of packages to meet the marketing needs. The advantages of stacking packages rather than chips is that the packages inside can be fully tested and ensure known good part prior to stacking. The development and evaluation work of 64DP packages was accomplished through close co-working of multi-teams especially assembly, product engineering and quality engineering. This paper describes the challenges in the process development, reliability testing; and failure modes observed during the qualification.