Methodology for Coupling and Interference Prediction in Integrated-Circuit Substrates

This paper presents a methodology to evaluate different integrated-circuit substrate technology options in terms of interference coupling. It is based on the electromagnetic characterization of the different substrate configurations as radial multilayered dielectric lossy open waveguides and the selection of the propagation modes that effectively contribute to substrate coupling. In addition, attenuation patterns are obtained for different technologies, doping profiles, frequencies, and interference mechanisms in order to provide a tool for early interference prediction, electromagnetic compatibility performance evaluation and floorplan strategy definition.