A high throughput test methodology for MCM substrates

This paper describes a new high throughput test methodology for a new multi-chip module (MCM) substrate. This is based on a new MCM substrate technology which contains interconnects, embedded passive devices, and mixed-signal circuits, currently being developed by the Packaging Research Center at Georgia Tech. The resulting MCM modules are called SLIM (single layer integrated module). In this paper a best methodology for SLIM modules is discussed.