A multichip module integration technology for high-speed analog and digital applications

We present a planar multichip module integration technology intended for high frequency applications. Bare dice are placed in substrate openings and connected thru a thin film multilayer realized in a planar fashion on top of the embedded system. It is built of dielectric polymer layers and a sputtered/electroplated copper wiring on ceramic or silicon substrate. Polyimid Pyralin/sup TM/ (2722 (Du Pont) and Cyclotene/sup TM/ (4026-46 (Dow Chemical) are used as interlevel dielectric. Metalization is based on a Ti:W/Cu tie layer, which is subsequently electroplated with Cu. The paper also addresses high frequency performance of the described technology, electromagnetic full-wave modeling and equivalent circuit model extraction.