Why the mounting inductance is important in designing a Power Distribution Network?

Minimizing the noise in a Power Distribution Network (PDN) is a critical step in Power Integrity (PI) design. The main effort is to keep the PDN impedance under a certain value in a frequency range by using decoupling capacitors, which can be at Printed Circuit Board (PCB) level, in package or in chip. Although you can get the same performance with any type of capacitor for high frequencies, it is important to consider the efficiency of decoupling capacitors in small ceramic casings at the expense of the large enclosures. Each PCB designer faces certain restrictions, including those related to the gauge plate, number of components, signal traces that need to be routed, so he will be able to achieve its goal increasing the effect of certain factors, [16][20][21][22]. The proximity of the capacitor to the chip and to its vias, and also its parasitic (equivalent series inductance and equivalent series resistance) determine the speed at which the capacitor reacts to the change in current. This paper reviews possible solution to minimize the noise in a PDN by answering the question “Why the mounting inductance needs to be minimize in order to have a proper Power Distribution Network (PDN) impedance?”. To answer of this question, will be used a SPICE equivalent circuit of the PDN. This allows both frequency and transient response to be done with SPICE simulation.