A novel high isolation interconnect for broadband mixed signal silicon MMICs

A novel interconnect and packaging concept for high-density, broadband mixed signal silicon MMICs is presented. Compared to conventional microstrip or stripline-based structures, the proposed silicon/metal/polyimide (SIMPOL) interconnect is very promising for extremely high isolation (>100 dB) between adjacent channels from DC up to 50 GHz, as indicated by simulations using a pre-verified full-wave FDTD code.