Inductance measurement of lead-frame packages

In the inductance measurement of lead-frame packages, according to the EIA/JEP123 Guideline, when the direct connection from the die-attach pad to the ground cannot be provided, the remote half of the leads are connected to ground to provide a low inductance current return path. In this paper, it is demonstrated through numerical simulations that this measurement set-up can introduce a considerable degree of error, especially for mutual inductance measurement. A new method is proposed to increase the accuracy of the measurement, and the effectiveness of the method is demonstrated by numerical simulation with FastHenry.