Electrical design of through silicon via (lee, m., et al; 2014) [book review]

This is a very interesting and well written book on a hot topic nowadays in signal and power integrity: the study of three dimensional integrated circuits (3D IC) with particular emphasis on the analysis and design of Through Silicon Vias (TSV). TSV, in very basic terms, is a metal pillar inside the silicon (Si) wafer with a silicon oxide coating (‘liner’) to block the DC leakage current between the metal pillar and the silicon wafer.