Foreword: Microelectronics system integration

IT IS A delight and honor to introduce this special issue of the IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY — PART B: ADVANCED PACKAGING. We feature six works, each of which was presented at ISIS'97, the 1997 IEEE International Conference on Innovative Systems in Silicon. As a showcase for microelectronics systems integration, the conference spans the spectrum from submicron device technology, through design techniques, and computer aided design, to systems architecture. The papers in this issue represent a peer-reviewed consensus of conference highlights, and reflect contemporary trends in applications, miniaturization, testing, and economics. Four of the contributions exemplify how to conceive, design, and implement a silicon system. The other two focus on effective application of technology and engineering resources in evaluating silicon systems.