High-precision and versatile optical measurement of different sides of ICs in the confectioning process using only one viewpoint

Quality checking and part measurement are well established procedures in manufacturing processes. There are requirements for complete part inspections e.g. in the manufacturing process of SMD devices. To check coplanarity of pins on all chip sides is such a requirement. The paper refers a solution allowing to perform the contactless inspection task for all four chip sides from one point of view. The required accuracy is reached by a special subpixel approach. For a test set, the comparison to a proved dial flow-meter has shown the high accuracy of the developed system.